Products

Diamond-abrasive fixed-pad for efficient lapping, TOPX®

Productivity improvement by stable removal rate.

Features

  • Stable removal rates by original pad structure.
  • Reduction of the removal machining time by fixed abrasive method.
  • Reduce treating cost of waste liquid and the load for environment compared to the loose abrasive method.
  • Reduction of the pad exchanging frequency by long product life.
  • Flexibility in the design for each requirements of lapping object, lapping time, and surface roughness

Applications

Substrate(Glass, Crystallized Glass, Quartz Glass, Sapphire), Semiconductor wafer(Si, SiC), Fine Ceramics(Al2O3), piezoelectric device(LiTaO3),

Lapping Data
  • Crystallized Glass
  • Aluminum Nitride
  • Quartz Glass
  • Lithium Tantalate

Stock Removal Rate(µm/min)

Roughness (Ra/Rz) at Batch No.10

SRR(µm/min) Ra(µm) Rz(µm)
Coarse Particle 64.3 1.19 6.01
Middle Particle 20.9 0.23 1.49

■Lapping conditions

6B-sized double-sided lapping machine
Load: 100g/cm2
Lower platen speed: 60rpm
Lapping time: 3min.
Coolant: A water-based coolant at 180ml/min

Substrate surface before lapping for Coarse particle pad: Mirror surface
Substrate surface before lapping for Middle particle pad: Lapped surface by coarse particle pad

Stock Removal Rate(µm/min)

Roughness (Ra/Rz) at Batch No.5

SRR(µm/min) Ra(µm) Rz(µm)
Coolant A 5.3 0.38 2.39
Coolant B 2.3 0.43 2.58

■Lapping conditions

6B-sized double-sided lapping machine
Load: 200g/cm2
Lower platen speed: 20rpm
1 Batch stock removal: 30μm
Coolant: A water-soluble coolant at 250ml/min

Substrate surface before lapping for Middle particle pad: Lapped surface by coarse particle pad

Stock Removal Rate(µm/min)

Roughness (Ra)

SRR(µm/min) Ra(µm)
Fine Particle 7.6 0.103

■Lapping conditions

5B-sized double-sided lapping machine
Load:100g/cm2
Lower platen speed: 60rpm
Coolant: A water-soluble coolant at 120ml/min
Substrate surface before lapping: Mirror surface

Stock Removal Rate(µm/min)

Roughness (Ra)

SRR(µm/min) Ra(µm)
Middle Particle 12 0.22
Fine Particle 1.7 0.042

■Lapping conditions

5B-sized double-sided lapping machine
Load: 100g/cm2
Lower platen speed: 90rpm
Coolant: A water-soluble coolant at 50ml/min

Substrate surface before lapping: Ra:0.24μm (After lapping)

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  • Development STORY