Diamond-abrasive fixed-pad for efficient lapping, TOPX™
Productivity improvement by stable removal rate.
Features
- Stable removal rates by original pad structure.
- Reduction of the removal machining time by fixed abrasive method.
- Reduce treating cost of waste liquid and the load for environment compared to the loose abrasive method.
- Reduction of the pad exchanging frequency by long product life.
- Flexibility in the design for each requirements of lapping object, lapping time, and surface roughness
Applications
Substrate(Glass, Crystallized Glass, Quartz Glass, Sapphire), Semiconductor wafer(Si, SiC), Fine Ceramics(Al2O3), piezoelectric device(LiTaO3),
- Lapping Data
-
- Crystallized Glass
- Aluminum Nitride
- Quartz Glass
- Lithium Tantalate
Roughness (Ra/Rz) at Batch No.10
SRR(µm/min) Ra(µm) Rz(µm) Coarse Particle 64.3 1.19 6.01 Middle Particle 20.9 0.23 1.49 ■Lapping conditions
・ 6B-sized double-sided lapping machine
Load: 100g/cm2
Lower platen speed: 60rpm
Lapping time: 3min.
Coolant: A water-based coolant at 180ml/min
Substrate surface before lapping for Coarse particle pad: Mirror surface
Substrate surface before lapping for Middle particle pad: Lapped surface by coarse particle pad
Roughness (Ra/Rz) at Batch No.5
SRR(µm/min) Ra(µm) Rz(µm) Coolant A 5.3 0.38 2.39 Coolant B 2.3 0.43 2.58 ■Lapping conditions
・ 6B-sized double-sided lapping machine
Load: 200g/cm2
Lower platen speed: 20rpm
1 Batch stock removal: 30μm
Coolant: A water-soluble coolant at 250ml/min
Substrate surface before lapping for Middle particle pad: Lapped surface by coarse particle pad
Roughness (Ra)
SRR(µm/min) Ra(µm) Fine Particle 7.6 0.103 ■Lapping conditions
・ 5B-sized double-sided lapping machine
Load：100g/cm2
Lower platen speed: 60rpm
Coolant: A water-soluble coolant at 120ml/min
Substrate surface before lapping: Mirror surface
Roughness (Ra)
SRR(µm/min) Ra(µm) Middle Particle 12 0.22 Fine Particle 1.7 0.042 ■Lapping conditions
・ 5B-sized double-sided lapping machine
Load: 100g/cm2
Lower platen speed: 90rpm
Coolant: A water-soluble coolant at 50ml/min
Substrate surface before lapping: Ra:0.24μm (After lapping)
