Nano silver paste for sintering FlowMetal™
A nano silver paste for die-attach bonding which can be bonded at low temperatures by applying the technology of low-temperature baking type silver nanoparticle ink.
Sinterable silver nanoparticle paste for low temperature bonding, applying low temperature sinterable silver nanoparticle ink technology
Features
- A bonding material using our unique silver nanoparticles
We manufacture nano silver paste for bonding materials using silver nanoparticles synthesized by our company.
Higher silver particle concentration (85-97wt%) is possible.
Lead-free. - Low bonding temperature and excellent heat resistance, electrical conductivity, thermal conductivity
The low-temperature baking type silver nanoparticle production technology has been applied to enable sinter bonding at low temperatures.
It is known that silver nanoparticles sinter at low temperature due to the size effect, and the melting point of the sintered silver is similar to that of bulk silver (962℃).
Typical bonding material, like solder melts again when exposed to high operating temperature. Those power semiconductors (SiC, GaN, etc.) which need to be used at high operating temperature cannot adopt ordinary solder.
Nano silver paste using silver nanoparticles is a new bonding material that solves the above problems.
Although the sintered body of silver nanoparticles is dense, it contains a small number of holes, so it is inferior to the intrinsic value of silver, but shows low electrical resistance, and high thermal conductivity*. - Pressure-free bonding
The low-temperature sintering process provides high bonding strength through diffusion reactions between the nanoparticles and the substrate metal.＊
Depending on the bonding conditions, pressure-free bonding may not be suitable. There is also a lineup that enables pressure welding. - Pressure-free bonding
The low-temperature sintering process provides high bonding strength through diffusion reactions between the nanoparticles and the substrate metal.＊
Depending on the bonding conditions, pressure-free bonding may not be suitable. There is also a lineup that enables pressure welding.
Uses
【Surface required】
Gold, silver, copper
【Printing method】
Capable of dispenser, metal mask (stencil) printing, and pin transfer.
【Application fields/uses】
Dies bonding, dies touch application
It is useful for bonding high frequency devices (RF) that operate at high temperatures, bonding in power semiconductor chips, light emitting diodes (LEDs), dies in semiconductor lasers (LDs), submounts,
and packages.
(*) Detailed data can be viewed by clicking the lineup.
