High thermal conductive sheet HEATEX™


  • HEATEX™ has an extremely high thermal conductivity in the thickness direction and contributes to the low thermal resistance of various electronic devices.
  • Lineup of insulation series.
  • High thermal conductivity, one of the highest in the market.
  • A rubber type soft sheet TIM without stickiness*.
  • (*) TIM: Thermal Interface Material

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HEATEX™ has vertically oriented thermally conductive fillers with high thermal conductivity. 
Above mentioned filler, which contains boron nitride has been used in the insulation series.
It can be used as an interface(TIM) to efficiently transfer the heat from heat-generating parts (CPU, LED backlight, power chip) to cooling parts (heat sink, so on..)

Electron micrograph of cross-sectional structure of insulation series with boron nitride vertically oriented

Image of using HEATEX™

Stable and easy to handle

Easy to handle

Because of using silicone rubber, it is hard to break even when bent, has a silky feel, and has excellent workability.
Rework is also possible.
Adhesive treatment of the sheet surface is available as an option.

Thermal stability

Maintains low thermal resistance in pressurized environments.
Even if it is used for a long time in a harsh environment of 200°C, there is almost no change in physical properties.
In addition, the pump-out phenomenon caused by thermal paste is less likely to occur.

* Pump out phenomenon

Materials that come into contact with grease undergo a pump-out phenomenon in which grease is discharged by repeating expansion and contraction as the temperature rises and falls.
When the pump-out phenomenon occurs, the contact thermal resistance increases due to the generation of voids, and the initial performance cannot be obtained.

Heat resistance test at 200°C

Graph: Heat resistance test at 200°C


Heat dissipation of heat-generating components of electronic/electric devices.

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